Why low refractive index epoxy resin adhesive glue maters in optical devices
Refractive index measures light speed or any waves like sound waves reduction within a medium. Typically, glass has an index of 1.5. this means that the light travels at 0.67 times its speed in glass.
Common glass properties and properties of other transparent materials are directly related to the refractive index. The first thing that happens is that the light rays change their direction as they cross into the material. After this, the light will reflect partially from the surface, and the refractive index is different from the surroundings. This is an effect that is used in glasses and lenses.
Studies have been done on epoxy resin, which was cured next to embedded silica fiber. It was monitored while in situ through wave spectroscopy. The curing was determined as temp and time function by analyzing the IR section from the resin adjacent to the fiber. The resin was fluorinated partially, and the refractive index was lower than that of the silica fiber. The epoxy resin has a lower refractive index which allowed the fiber to act as the waveguide for the reflection of the IR light that was close. This was attained by the evanescent wave interaction, which occurred at every internal reflection with an epoxy resin.
The low refractive index of epoxy is not usually reported. The refractive index can be defined as a ratio of light speed of a certain wavelength within the vacuum to the light speed of a similar wavelength within the substance measured. This is one of the most important properties of the cured epoxy adhesives used in assembling different optical devices.
Why low refractive index epoxy resin adhesive glue is used in optical devices
Today, polymers are being used in electro-optical and optical devices due to their many superior properties over inorganic materials. They are easy to fabricate, lightweight, transparent, and can be molecularly tailored using controlled synthesis. The main application for the materials includes optical and compact disks, optical fibers, and flat panel displays.
Based on the assembly of the optical devices, they can be divided into distinct groups. One is where they can be used to join optical sections where light is passed. The other is where the adhesive is used to reinforce the bond between the components without necessarily passing any light. The devices consist of many electrical optical, and optical parts, and the adhesives are usually applied to bond the different components.
When an adhesive is used in the areas where light passing is needed, it should reduce light reflection as much as possible. If the light is reflected at the junction, there may be interference. This is often true when it happens very close to the light source. To minimize the reflection, the adhesive used in the circuits should include the capacity to bond and optical compatibility with the substrates. This gives the best light transmittance degree, and refractive indexes as the bonded materials sustain the best optical properties and reduce distortion.
This is to say that when it comes to assembling optical components, the refractive index of the adhesive needs to be considered when picking the best for the job. This is the reason why epoxy resins are used for such purposes. They have an amazing bonding ability with different materials, including plastics, wood ceramics, glass, and metals.
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.
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DeepMaterial
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