DM-6016E | Epoxy potting adhesive | Black | 58000~62000 | @ 150℃ 20min | PCB board sensitive inserts, transistors, smart card IC card packaging | For applications where excellent handling properties are required. Cured materials exist for severe thermal shock and provide continuous heat resistance to 177°C. Particularly suitable for the packaging of transistors and similar semiconductors, can be used for the packaging of watch integrated circuits, component encapsulation adhesive, for PCB board sensitive inserts, transistors, smart card IC card packaging. |
DM-6058E | Epoxy potting adhesive | Black | 50,000 | @ 120℃ 12min | Packaging of sensors and precision components | This product provides excellent environmental and thermal protection for packaging components, and is especially suitable for the protection of sensors and precision components used in harsh environments such as automobiles. |
DM-6061E | Epoxy potting adhesive | Black | 32500~50000 | @ 140°C 3H | PCB board sensitive inserts, transistors, smart card IC card packaging | Component encapsulation glue, used for packaging sensitive plug-in PCB boards, excellent viscosity stability, easy to control the size of the glue. After passing 1000H temperature/humidity/deviation test and thermal cycle to 125℃. The special viscosity stabilized at 25°C provides a more easily controlled size using conventional time/pressure dispensing equipment. |
DM-6086E | Epoxy potting adhesive | Black | 62500 | @ 120℃ 30min 150℃ 15min | IC and Semiconductor Packaging | Used in applications requiring excellent handling properties. For IC and semiconductor packaging with good heat cycle capability, material can withstand thermal shock continuously up to 177°C |
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