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DeepMaterial adhesives » Products » DeepMaterial Epoxy Based Conductive Silver Adhesive

DeepMaterial
Epoxy Based Conductive Silver Adhesive

DeepMaterial Conductive silver adhesive is a one-component modified epoxy/silicone adhesive developed for the integrated circuit packaging and LED new light sources, flexible circuit board (FPC) industries. After curing, the product has high electric conductivity, heat conduction, high temperature resistance and other high reliable perfor- mance. The product is suitable for high-speed dispensing, dispensing good type protection, no deformation, no collapse, no diffusion; The cured material is resistant to moisture, heat and high temperature. Can be used for crystal packaging, chip packaging, LED solid crystal bonding, low temperature welding, FPC shielding and other purposes.