| Product line | Product Name | Product Typical Application |
| Conductive Silver Adhesive | DM-7110 | Mainly used in IC chip bonding. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle. |
| DM-7130 | Mainly used in LED chip bonding. Using the smallest dose of adhesive and the smallest residence time for sticking crystals will not cause tailing or wire drawing problems, greatly saving production costs and waste. It is suitable for automatic adhesive dispensing, with excellent adhesive output speed, and improves production cycle time. When used in the LED packaging industry, the dead light rate is low, the yield rate is high, the light decay is good, and the degumming rate is extremely low. |
| DM-7180 | Mainly used in IC chip bonding. Designed for heat-sensitive applications that require low-temperature curing. The sticking time is extremely short, and there will be no tailing or wire drawing problems. The bonding work can be completed with the smallest dose of adhesive, which greatly saves production costs and waste. It is suitable for automatic adhesive dispensing, has a good adhesive output speed, and improves the production cycle. |
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