PUR Structural Adhesive
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- UV Curing UV Adhesive
- Reactive Hot Melt Adhesive And Pressure Sensitive Hot Melt Adhesive
- Epoxy-Based Chip Underfill & COB Encapsulation Material
- Circuit Board Protection Potting & Conformal Coating Adhesive
- Epoxy Based Conductive Silver Adhesive
- Structural Bonding Adhesive
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- Applications
- Smartphone Application
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- TWS Headset Application
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- Digital Battery Application
- Camera Module Application
- Chip Manufacturing Process Application
- Smart Wristband Application
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- Eletric Car Application
- Electronic Cigarette Application
- Smart Speaker Application
- Smart Glasses Application
- Photovoltaic Wind Energy Application
- Solutions
- Glass fiber adhesive
- Display shading glue
- BGA package underfill
- Camera VCM Voice Coil Motor Glue
- Mobile phone shell tablet frame bonding
- Glue for fixing camera module and PCB board
- Lens structure parts bonding PUR glue
- Hot pressing decorative panel bonding
- TV backplane support column and reflective film bonding
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