The necessity of picking low and high epoxy resin refractive index liquid polymer adhesive glue coatingfor optical device assembly
There are many optical cameras and sensors that are being added to different devices today. It is more than the smart devices today, there are other applications that need an optical pathway. So as to support the applications, materials are being tailored with the best optical properties.
There are many considerations that have to be taken when choosing the best. Apart from the considerations, there are issues that you need to be aware of to make the best decision and eliminate them. Picking a high refractive index adhesive may be a requirement in some applications.
One of the technical issues that must be handled is haze. One thing to note about haze is that it happens after high humidity and high temperature testing reliability. The haze can be seen on the edges and grow into active areas. In such a case, the adhesive could have absorbed moisture. In case the structure of the adhesive is not capable of preventing the hydrolysis performance, it degrades much more easily.
The other key consideration is curing the edge completely so inhibition of oxygen is influenced. If the oxygen inhibition is affected, the edge has a tackiness that can absorb moisture in the reliability rest. This is to say that haze depends on the properties of the adhesives. In many cases, haze and delamination may occur at the center or edges. Sometimes they appear randomly.
Optical performance
High refractive index adhesive must maintain the highest optical performance data even after reliability conditions. The thickness of the adhesive is crucial when designing because it can achieve up to 300 um thickness. The optical performance can get worse in such a case because the area of contact with the atmosphere has been attacked by low humidity in the reliability tests.
It is important for adhesives to be capable of surviving high humidity and high temperature tests. The adhesives need to survive the UV exposure test as well. This is because UV exposure tests oxygen, wavelength, and high temperature.
The above factors can affect the yellowness of an adhesive. This means that the optical performance can be affected by two main things: the optical design of the particular structure as coating or sandwich and the reliability test as UV and high temperature exposure test.
Considerations
Before assembling optical devices, it is important to consider the refractive index performance as well as the optical plastic lens and what they have in terms of characteristics. It is important for the refractive index of the lens to match that of the adhesive. There are times when a mismatch exists. This is because the optical path can be influenced when a mismatch is present. In such a case, you may notice interface fringes. When there is a refractive index range in the adhesive, it contributes to a much easier optical design.
When there is a high refractive index in normal resins, there may be a high reflection loss problem where there is adhesion with crystal materials and glass with a high refractive index.
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.
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DeepMaterial
Best epoxy adhesive glue manufacturer in China, our adhesives are widly used in consumer electronic, home appliance, smart phone, laptop and more industries. our R&D team customizes glue products for customers to help customers reduce costs and improve process quality. Glue products are delivered quickly and ensure their environmental friendliness and performance.
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