The company continues to modify the application of adhesives and resin materials, and the company's strategic plan will focus on the development of EB curing adhesives and new semiconductor materials. EB curing adhesives and resins will break through the technical bottlenecks such as curing time, open operation time and bonding strength of any structural adhesive in the world, thereby forming no open time, no curing time (super fast nanosecond curing), high viscosity new adhesives with high bonding strength will break the current use of electronic products and component assembly, precision sensors, PCB circuit board substrate processing, PCB circuit board etching processing (etching process above 195nm), new energy (battery and wind power potting, bonding). The market adhesive application rules for the building materials industry (composite panels); the application of EB curing and irradiation technology in the direction of semiconductor materials will break through the current technological monopoly of semiconductor protective materials by Japanese companies and achieve technical overtaking on a curve.
Shenzhen Protective Film R&D Laboratory / Guixi Production Base Analysis & Inspection Laboratory
Shenzhen Protective Film Comprehensive R&D Laboratory 300 Square Meters
Guixi Production Base Analysis And Inspection Laboratory 400 Square Meters
The company has passed ISO9001 quality management system certification and ISO14001 environmental management system certification, and passed the GB/T 29290 intellectual property management system certification, and is in the process of TS16949 management system certification.
In the future, the company will continue to achieve compliance and standardization of the management system.
The company applies for more than 50 invention patents and utility model patents each year, maintain the company's market leadership and technological innovation through continuous technological innovation.