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DeepMaterial adhesives » Applications » Camera Module Assembly Application

Camera Module Assembly Application of DeepMaterial Adhesive Products

Camera module adhesive

In the field of electronics, adhesives are used in particular for cell phone and smartphone camera modules. This includes the bonding of individual components—such as lens-to-lens mount or lens mount-to-camera sensor—, securing camera chips to circuit boards (die attach), using adhesive as chip underfill, Low pass bond the filter and glue the assembled camera module into the device housing.

Special adhesives enable precise assembly and durable bonding of smaller camera module assemblies. The adhesive used is suitable for mass production of camera modules and cures rapidly at low temperatures.