The need for the best one component BGA underfill high refractive index epoxy resin optical adhesive glue for flip chip underfill
Today, so many optical cameras and sensors are integrated into electronic gadgets. These are not only found in smart devices, wearables, and automotive sensors. They are also found in waveguide imprinting, lens bonding, and other applications that fall in the optical pathway. To help support the applications, one needs materials that have tailorable optical properties. Usually, the refractive index is mismatched between the plastic lenses like UV curable liquid adhesive, PMMA, COC, COP, and PC.
UV curable liquid adhesive is a good choice, and its refractive index can be easily changed while maintaining a good optical performance as transmittance, haze, and yellowness index. When the refractive index is wide, there are many possibilities, and you can develop an optimized design. When you are using a certain plastic lens, you need to consider how a chemical attack occurs in that process. There is also a consideration that before curing the adhesive, chemical components can attack the lens, which can delaminate and crack.
It is important to check the reliability data of high index optical adhesive and how it performs under different conditions.
The need for high index optical adhesives
Different electronic devices need high index optical adhesives. They can be used in different areas where there are optical pathways. These types of adhesives are chosen in areas where the refractive index is mismatched, and optimal performance has been obtained between the lens and the adhesive.
The data that you will need to collect when picking the best adhesive include:
• The risk regarding the adhesive thickness and lamination structure
• Optical performance data for the high refractive index of the adhesive
• Comparisons between the optical plastic lens and adhesive refractive index
• What causes chemical attacks in the plastic lens
• How oxygen inhabitation is solved
With this kind of data, you can easily decide on the best high index optical adhesive. The thickness of the adhesive, the lens size, and the lens structure come with different advantages and risks.
Usually, you may have to deal with different technical issues, which are delamination and void process. The delamination and void result from the adhesives properties and the process involved. You can solve the void issue by optimizing the process.
The property of the adhesive is often related to the wettability and viscosity of the adhesive to handle void issues. If a void forms within the center part, reducing it can be very hard once the adhesive is cured. This void cannot move towards the edge. If you want to reduce the occurrence of voids then use the vacuum process.
The challenge with using the vacuum process is that you must consider this an investment and care for the substrate. Air lamination can be used as an alternative to this.
Delamination is tricky because its appearance is similar to chemical attacks. Delamination can occur at the edges because, at this part, there is a thin layer that forms once the process has been concluded, especially with the lamination of a curved lens.
Tensile modulus, tan delta, and elasticity all have a great effect on the delamination. The structure of the lens and its size can also be a cause of delamination. To solve the issue, you need to find a tan delta, elasticity, and tensile modulus that is optimized. The properties relate to monomer and oligomer adhesives.
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.
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DeepMaterial
Best epoxy adhesive glue manufacturer in China, our adhesives are widly used in consumer electronic, home appliance, smart phone, laptop and more industries. our R&D team customizes glue products for customers to help customers reduce costs and improve process quality. Glue products are delivered quickly and ensure their environmental friendliness and performance.
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