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Underfill adhesive materials for flip chip applications

Read more articles about Underfill adhesive materials for flip chip applications, Underfill adhesive materials for flip chip applications sealants, adhesive & glue products in China.
2023
DATE
11 - 09
How Long Does It Take For Chip On Board Epoxy Adhesive Glue To Cure?
How Long Does It Take For Chip On Board Epoxy Adhesive Glue To Cure?In the world of electronics manufacturing and assembly, one question that often arises is: "How long does it take for chip on board (COB) epoxy adhesive glue to cure?" This seemingly simple query is, in fact, a complex one with a mu
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2022
DATE
07 - 06
The need for the best one component BGA underfill high refractive index epoxy resin optical adhesive glue for flip chip underfill
The need for the best one component BGA underfill high refractive index epoxy resin optical adhesive glue for flip chip underfillToday, so many optical cameras and sensors are integrated into electronic gadgets. These are not only found in smart devices, wearables, and automotive sensors. They are a
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