Glues, adhesives, sealants, and encapsulants are produced in various forms and chemistries. All of these adhesives come with unique features which are produced to solve certain needs or problems. Scientific and technological advancements have made it possible for adhesives to be engineered and treated to perform certain functions.
Choosing non conductive glues and adhesives for various tasks
It can be quite a challenging task to choose the most suitable non conductive adhesive to be used in special cases. This is because the market is full of various adhesives and glueing products which come in various forms and chemistries. In consideration of choosing non conductive adhesives, it is logical to use logical criteria to choose whichever glue product that you need. This is because there are usually several variables that you have to consider. If you understand the following parameters, then you will be able to easily choose the right non conductive glue for electronics. It is important to consider these variables in industrial situations. This helps to minimise defects while minimising the number of products that you have evaluated.
1) Substrates: It is important to know what materials that you are glueing together. Some adhesives are ideal for glass or ceramic. It is important to know the right substrate because it can be important to help you to determine the right adhesive. Plastic and metal are generic words that are used to mean a wide range of products and materials. For example, polytetrafluoroethylene (Teflon) and ABS are both plastics. However, PTFE needs some acid etching to be able to achieve some form of bonding whereas ABS can be bonded easily by simple cleaning with alcohol.
2) Cleaning parts: Many adhesives require that you properly prepare the substrates. It could be just a mere cleaning or performing more complex tasks like abrasion, plasma treatment, or chemical etching. This all play an important role in helping you choose an adhesive.
3) Low viscosity: Non conductive glues that have low viscosity are ideal for applications that need wicking or for thin bonds. Thixotropic materials are ideal when used in vertical applications.
4) UV cure or thermal cure: UV cure glues can be quickly cured. However, for them to cure, they will have to be exposed to ultraviolet light for the curing to take effect. This means that one of the substrates to be glued will need to support UV light transmission. Thermal cure materials are usually cured with heat or at room temperature. Thermal adhesives that are cured with heat will need high temperatures which could easily damage the components. Generally, they tend to cure a lot faster with properties that are a lot higher.
5)Durability/Working life: It is good to determine the amount of work-life that you need. You should know that the working life (time taken for the material to gel) is typically linked to the time needed for curing. For materials that require a thermal cure, the longer the durability, the curing time will be a lot longer.
6) Parts to be glued: One other thing to consider when glueing with non conductive glues is the fact that you have to consider the parts to be glued together. It is also important to determine how the parts fit together. This will go a long way in understanding the best material to be used for glueing. Gaps with thicker bonds and larger parts may need a slower cure process to minimise shrinkage. Some adhesives have been made to work properly with thinner/slimmer gaps.
7) Performance required: When it comes to the performance of adhesives, there are a wide range of features that can be considered. Certain performance variables should be considered when choosing non conductive glues for your projects and product assembly.
8) Exposure to high humidity: Excess humidity on adhesives cause them to have a softer quality or a foamy appearance. Some adhesives are not impacted by humidity in a given range. But if the substrate has condensation formed on it, the strength of the bond will be negatively affected. Humidity and moisture both affect the performance of the adhesion. In high humidity, adhesives have a slower drying time while at low humidity, the process of drying happens in days.
9) Temporary or permanent bonds: Adhesives have a bonding strength which is the interfacial strength that exists between the substrate and the adhesive. This is one of the most essential features when designing an adhesive assembly with a strong bond. Even if the toughest adhesive in the world is used, a bond tends to fail whenever the adhesive fails to bond to the substrate's surface.
10) The working temperature of the adhesive: There are a lot of environmental factors that determine the performance of adhesives over a while. The most important environmental factor to consider when choosing an adhesive is temperature. For many non conductive adhesives, minor temperature changes can have a major effect on the storage life and cure speed of the adhesive. Many adhesives will work normally in a long temperature range, however, any temperature increase leads to a significantly dropped performance. Thermosetting adhesives like formaldehyde, phenolic, and melamine resins create strong bonds and can resist higher temperatures. With non conductive glues, curing is usually slower with lower temperatures while faster with higher temperatures.
11) The surfaces of the substrates to be glued: A non conductive glue will usually be applied to two surfaces before it is glued. Using adhesives as glues involves the attachment of two substrate surfaces, this is unlike fusing substrates into a larger piece like plastics solvent activation or welding metals. The surface conditions of the substrates should have to be considered. Things to be considered are the size of the materials, flexibility, cleanliness, uncoated, coated, porosity, smoothness, and roughness. This means that based on physical conditions, some adhesives will not bond certain surfaces. Some epoxy adhesives need a good surface preparation process like roughening, cleaning, and so on. The surface preparation process makes it easy for the adhesives to form a bond between the substrates.
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.
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DeepMaterial
Best epoxy adhesive glue manufacturer in China, our adhesives are widly used in consumer electronic, home appliance, smart phone, laptop and more industries. our R&D team customizes glue products for customers to help customers reduce costs and improve process quality. Glue products are delivered quickly and ensure their environmental friendliness and performance.
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