Views: 321 Author: Site Editor Publish Time: 2022-02-22 Origin: Site
The difference between structural adhesives and non-structural adhesives is mainly reflected in the bonding strength. It is completely differentiated by resin type.
Structural adhesive, with high bond strength, the bond can bear a large load, high shear strength, high uneven tear strength, and the bond can withstand shock, vibration, fatigue, etc. load test. In addition, structural adhesives have certain properties such as heat resistance and weather resistance, and the bonded structural components can work in relatively harsh environments. According to the main components, common structural adhesives include modified phenolic resin, modified epoxy resin, unsaturated resin and other adhesives. PUR hot melt adhesive is a one-component solvent-free hot melt structural adhesive.
Non-structural adhesives generally do not bear any large load, and are used for bonding parts with less stress or for positioning. There are also many varieties of non-structural adhesives, such as polyurethane, neoprene, urea-formaldehyde and other adhesives.
Share: The formula of epoxy resin adhesives cured at room temperature with general amines can only be used for the bonding of non-structural parts. If it is modified, it can become a good structural adhesive.
At present, there is no recognized consensus on the definition, classification and evaluation standards of structural adhesives at home and abroad. Views vary across industries.
(1) The American aviation structural adhesive standard MMM-A-132 divides structural adhesives into four types according to the requirements for heat resistance at different Mach number flight speeds, and evaluates shear, fatigue, creep, aging, T The strength indicators such as type peeling have been specified.
The flight speed corresponding to Type I is below Mach 1, and the strength index at room temperature and 82°C is specified; Type II corresponds to Mach number 1 to 2, and the strength index at room temperature and 149°C is specified; Types III and IV correspond to From Mach 2 or more to about Mach 3, strength indicators at room temperature, 149°C and 260°C are specified. The last three types are high temperature structural adhesives for supersonic aircraft.
The I type is divided into three grades according to different strengths, and the regulations are as follows: the first grade is used for the bonding of the main stress structure, which is a structural adhesive; the second grade is used for the bonding of the secondary stress structure, which is a quasi-structural adhesive; There is no requirement for peel strength and should belong to non-structural adhesives.
(2) There is no national standard for the definition and classification of structural adhesives in my country. Generally, structural adhesives are divided into two categories: high-strength, high-toughness, medium-strength, and medium-toughness according to the force of the bonding object and the bonding strength: main stress The steel-to-steel shear strength of the structural adhesive is greater than or equal to 25MPa, the tensile strength is greater than or equal to 33MPa, and the uneven pull-off strength is greater than or equal to 40kN/m. The shear strength of the adhesive for secondary stress structure is 17-25Mpa, and the non-uniform pull-off strength is 20-50kN/m.
Epoxy resin structural adhesive refers to a type of adhesive that adheres to stress-receiving structural parts. In the connection of structural parts, gluing has greater advantages than traditional riveting, screwing and welding. Epoxy resin structural adhesive has high strength and toughness, good comprehensive performance, and high safety and reliability of bonding. The formula design is flexible, the selectivity is large, and it can adapt to various use requirements. It is the most important and most reliable product in structural adhesives. With the improvement of building safety requirements, its importance is becoming more and more known.
a. Epoxy structural adhesives can be divided into four categories according to the curing temperature: high temperature curing, medium temperature curing, room temperature curing and low temperature curing.
(1) High temperature curing epoxy structural adhesives have high temperature, toughness, heat resistance, etc., and are mostly used for bonding of main stress structures;
(2) The medium temperature curing epoxy structural adhesive is mainly a kind of glue developed to meet the needs of the aircraft industry. Since the aluminum alloy begins to show the tendency of grain boundary corrosion above 120 ℃, it will intensify with the increase of temperature. After the grain boundary corrosion The strength and toughness of green alloy will decrease, so the curing condition of the adhesive for bonding aluminum alloy is required not to exceed 130℃/4h;
(3) The application of room temperature curing epoxy structural adhesive is more extensive. The application in the field of civil construction is more important, and it is one of the main varieties of building structural adhesives;
(4) Low temperature curing epoxy adhesive is a new type of adhesive developed in recent years in order to meet the needs of low temperature construction in winter. It can be constructed and cured at 0 °C or even below -10 °C. (A low temperature curing epoxy adhesive developed by Kane KY company, 80 ℃ relatively low temperature curing, does not affect sensitive components, high bonding strength, used in the bonding of camera module structural parts)
b. According to the heat resistance, structural adhesives can also be divided into three types: general type (≤80℃), high temperature resistant type (≥150℃) and medium temperature resistant type (between the former).
Construction adhesive is an indispensable material in construction engineering and is widely used. In the process of building decoration and decoration, it is mainly used for sheet bonding, wall pretreatment, wallpaper pasting, ceramic wall and floor tiles, various floors, carpet laying and bonding, etc., which increases waterproofness, sealing, elasticity and impact resistance. It can not only improve the quality of building decoration, increase the beauty and comfort, but also improve the construction process, improve the efficiency and quality of building construction, etc. Due to its wide range of applications, there are many kinds of them, which are classified according to bonding strength and use:
a. Structural type
(1) Building structural adhesives: steel glue, planting glue (anchor glue), pouring glue, carbon fiber reinforcement glue, etc.;
(2) Curtain wall structural adhesive: dry-hanging adhesive, silicone structural adhesive;
b. Unstructured
(1) Adhesive adhesives: floor glue, floor tile glue, wallpaper glue, plastic pipe glue, stone glue, bamboo and wood glue, etc.;
(2) Sealant: polysulfide sealant, butyl sealant, silicone sealant, etc.
Product Category: Epoxy Encapsulant
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
Product Category: Epoxy Underfill Adhesive
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Product Category: Conductive silver adhesive
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
Product Category: Epoxy Structural Adhesives
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Product Category: UV curing adhesive
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
Product Category: PUR reactive hot melt adhesive
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.