Selecting an ideal lens bonding temporary uv curing epoxy optical adhesive and sealant for optics and optical assembly
Optics engineers usually need uv curing optical adhesives to help bond different components during optical assembly. They can also be used during fiber optical assembly, optical element fixturing and positioning, and prisms and lens bonding. Each adhesive available in the market has its limitations and its strengths. This is what makes it a great challenge to determine the material that is most suitable for the job at hand. You need to consider carefully and weigh all your material properties based on the application requirements. This has to be balanced against the demands of the process.
The refractive index and optical transmission are some of the most basic considerations of whether the adhesive is the right choice. Choosing a temporary uv curing optical adhesive must be done carefully and consider some things.
Properties
When adhesives start curing, it is common for them to shrink. This can lead to stress and may cause alignment or focusing issues. Because of this reason, you should pick a temporary uv curing optical adhesive with low shrinkage. Some UV curing adhesives are special and can shrink 0.2 to 0.4 percent while maintaining their optical clarity. For the performance and integrity of the structure, the modulus and hardness of cured material are important. In the case of fiber optic adhesives, it may be necessary to have a hard cure to ensure that the fiber does not move and to allow polishing.
Outgassing
This should also be a consideration to make. This is the release of some volatile materials post and during cure. When you are selecting an adhesive, this should be one of the things that you look into. This is one of the things that can help you determine whether there will be quality issues or not.
Curing method
The curing method of the temporary uv curing optical adhesive needs to be considered. The type you pick will determine how effective it will be for the project you handle. It will affect the complexity and speed of the project. Some adhesives cure within a few seconds and could be beneficial if you need them in production. Rapid curing is important during focusing and alignment, where the adhesive is cured quickly after the process is complete. This can help create some complex fixtures and jigs for assembly.
UV cured adhesives are fast compared to the two-part optical epoxies. The curing process may be accelerated using heat in some cases. However, this thermal excursion may cause stress during and after the cure. Epoxies offer good temperature and chemical resistance as well as hardness. They can resist autoclaving cycles.
Viscosity
An adhesives viscosity is another thing you need to consider when picking a temporary uv curing optical adhesive. This usually depends on the purpose of the adhesive. Is it intended for filing a gap, bridging it, or wicking into one? The mixing process is of great concern when a system has been specified. To get a homogeneous mix, special equipment may be needed. If the mixing processes release toxic fumes, then degassing will be required.
UV curable adhesives are so popular for optics because they are quite easy to use, and the cure time is quite rapid. If you need a temporary uv curing optical adhesive, the above are some of the most important things you should consider.
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.
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DeepMaterial
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