Views: 29 Author: Best Electronic Adhesives Glue Manufacturer Publish Time: 2022-12-16 Origin: https://www.deepmaterialcn.com/
Potting compound vs. epoxy for effective electronic and pcb protection
Potting compounds are an important product that is used for potting electronics. This has to be done in the most effective way possible to ensure adequate protection against different environmental influences. It is the best way to improve electrical insulation and mechanical strength.
In the electronics industry, potting compounds are important and remain at the front line. They deliver the best protection against the most challenging conditions in the environment. Electrical insulation and mechanical strength are the other important areas that potting assists in.
The potting compounds are used widely in different industries where assemblies are needed, like aerospace and automotive. The materials used offer a protective solution that remains a part of the unit. They bring with them many benefits.
The benefits associated with electronic potting compounds
• They keep components safe from all sorts of environmental influences
• They offer great chemical protection
• They offer corrosion protection
• They give the best shock and vibration resistance
• Heat dissipation
• Better mechanical strength
• Electrical insulation
It is important to note that different compounds are better in certain areas but not so good in others. This is why picking one that matches your applications is so important.
With potting compounds, you can solve so many issues that are often present in assembly and manufacturing areas. You should use potting compounds to offer the best protection against any moisture and to prevent the occurrence of short circuits. They offer great protection even where complex assemblies are concerned. They are the best in the most challenging environmental conditions.
Where does epoxy come in?
Different potting compounds can be used in various setups and applications. The potting compounds are needed to solve some specific issues. There are so many things that can be achieved in the electronic industry owing to the presence of potting compounds.
Epoxy is a type of potting compound. This is one of the best solutions when you want to improve the mechanical strength of your components or applications. Epoxy is one of the most popular compounds that can be used, and it has its strong and weak points. This compound can be customized to meet very specific needs as the market requires.
Epoxy compounds are made to work within temperatures no more than 180 degrees. While there are other compounds that can handle much higher temperatures, epoxy meets the shortfall by giving the highest mechanical strength in comparison.
The other issue is that, because of how strong epoxy is and how hard it cures, it is not a flexible option, and it can be hard or impossible to get it off. Epoxy can be used in heavy machinery and automotive kind of applications. It is the to-go choice when dealing with the harshest environmental conditions.
Bottom line
Epoxy is a type of potting compound. Other options available in the market today include urethane potting compounds, silicone, polyacrylate, and electronic potting gel.
All the formulations have their set of pros and cons. To get the best, take time to look at the products we deal with at DeepMaterial. We have lasting solutions and custom-made options to pick from. By understanding what is needed, making up your mind should not be hard.
We have been in the market for a long time making us one of the best in the industry. We provide the highest quality options to meet the demand.For more about potting compound vs. epoxy for effective electronic and pcb protection,you can pay a visit to DeepMaterial at https://www.epoxyadhesiveglue.com/category/pcb-potting-material/ for more info.
Product Category: Epoxy Encapsulant
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
Product Category: Epoxy Underfill Adhesive
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Product Category: Conductive silver adhesive
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
Product Category: Epoxy Structural Adhesives
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Product Category: UV curing adhesive
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
Product Category: PUR reactive hot melt adhesive
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.