One part component epoxy adhesive glue for electronic optics and optical assembly
One component epoxy adhesives play a significant role in the optical industry and assemblies. It gets used to bond several essential components together like prisms, lenses, and other optical assembly parts.
What are the General Properties of One component epoxy adhesives Used in Optics and Optical Assembly?
Each one component epoxy adhesive used for optics and optical assembly possesses a few limitations and strengths. It allows them to perform their role and become the most suitable option for a particular task. Their selection for a specific job depends on their abilities, process demands, and application requirements.
A few general attributes and properties possessed by one component epoxy adhesives used in the optical industry entail the following:
• Low Shrinkage
All one component epoxy adhesives, irrespective of their constituent material, tend to shrink in volume. It primarily happens during the curing process. It, in turn, causes undesirable stress on the various optical parts and components. Thus, it can lead to alignment and focusing problems during the assembly.
Such issues can get resolved by using an one component epoxy adhesive having low shrinkage abilities. It helps overcome the problems significantly.
• High Clarity
Optical clarity is an essential property all one component epoxy adhesives used in the optical assembly must possess. They should not result in clouding or haze after application. Furthermore, the clarity should get retained for a considerable time.
• Rapid Curing
The one component epoxy adhesives must cure substantially fast and “hard.” It is necessary to allow for appropriate polishing. Furthermore, it prevents detrimental fiber movement. Overall, a rapid and “hard” curing enables superior performance and integrity of the resultant structure.
• Low Outgassing
Optical one component epoxy adhesives should not allow for significant outgassing. Otherwise, the release of various volatile materials and substances after and during the curing process can condense over the optical surfaces. It, in turn, can lead to several quality issues.
What are the Different One component epoxy adhesives Used for Optics and Optical Assembly?
Generally, six one component epoxy adhesive types get utilized for optics and optical assembly, namely:
• Epoxies
Epoxies can bond securely to various substrates and have low outgassing properties. They tend to cure comparatively slower but have minimal shrinkage after the curing process.
Epoxies conventionally get used for bonding dissimilar materials, underfilling, and potting. Also, they can join structural reinforcements, fiber onto packages, and strain relief boots.
• Light Curable Acrylics
Light curable acrylics possess exceedingly low shrinkage and outgassing values. Additionally, they have considerable resistance to UV radiation.
Cured acrylic one component epoxy adhesives can deliver superior chemical, environmental, and thermal resistance. The curing process is exceptionally fast. Moreover, these one component epoxy adhesives promote significant flexibility.
• Elastomers
Elastomers are highly flexible one component epoxy adhesives having considerable resistance to moisture and heat. They can bond to various substrates and are ideal choices for stress absorbers.
• Anaerobics
Anaerobics can offer high strengths and quick fixture time. Also, they have high temperature and environmental resistance. It makes them suitable for bonding ferrules to fibers.
• Structural One component epoxy adhesives
Structural one component epoxy adhesives can help acquire significant strength with a curing time of fewer than two minutes. Moreover, they have an appropriate impact and environmental resistance, making them suitable for weld replacement. Furthermore, they allow for the structural bonding of metals and plastics.
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.
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DeepMaterial
Best epoxy adhesive glue manufacturer in China, our adhesives are widly used in consumer electronic, home appliance, smart phone, laptop and more industries. our R&D team customizes glue products for customers to help customers reduce costs and improve process quality. Glue products are delivered quickly and ensure their environmental friendliness and performance.
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