Views: 124 Author: Best Electronic Adhesives Glue Manufacturer Publish Time: 2022-08-15 Origin: https://www.deepmaterialcn.com/
Low Viscosity High Impact Optically Clear Epoxy Adhesive Glue For Mini Led Display Panel And Small Led Display Screen
What Do We Know About Optically Clear Epoxy Adhesive?
Optically clear epoxy adhesive is a pure fixing substance that can get cured using UV radiation. It offers superior adhesion to diverse substrates. Thus, it can get used for different and distinct applications across the optical industry.
Optically clear epoxy adhesive gets preferred over optically clear acrylic adhesive for specific uses and applications. It can get owed to the former's higher thermal resistance and lower shrinkage. The most common use of optically clear epoxy adhesive lies in the optical market that deals with lens bonding.
For What Do Optically Clear Epoxy Adhesive Generally Get Utilized?
Optically clear epoxy adhesives generally get used for coating or bonding in various fiber optic applications. They get utilized for bundling optical fibers and fixing specific components and parts in optoelectronic devices. The latter can get used for aircraft, satellites, telecommunication networks, scientific instruments, and medical apparatus.
The primary use lies in applications that entail UV radiation resistance and non-yellowing after the curing process.
What are the Various Features and Benefits Associated with Optically Clear Epoxy Adhesives?
The features and attributes of optically clear epoxy adhesives make them highly suitable for use in the optical industry. It can get owed to the advantages these characteristics bring.
A few features of optically clear epoxy adhesive consist of the following:
• Chemical and Water Resistance
An optically clear epoxy adhesive has a high chemical, humidity, and water resistance. It prevents the fixed components from getting affected by moisture or detrimental substances that can degrade their quality and ability. It allows the adhesive to pot LED lights and acquire maximum light transmission. Additionally, this property helps in cases related to electronic assemblies in which component identification is necessary.
• Non-Porous
An optically clear epoxy adhesive has superior non-porous properties. It prevents the diffusion or movement of water molecules across the adhered components, enhancing the water-resistant feature.
• Impact Resistant
Optically clear epoxy adhesives can withstand significant impact owing to their high resistance. It helps protect the parts and components the fixing substance bonds. On top of that, it allows the adhesive to get drilled, painted, and sanded.
• Electrical Insulation
Optically clear epoxy adhesives offer high insulation and resistance to electrical current conduction or passage.
• Fast Curing
Optically clear epoxy adhesives require less curing time. Generally, they set within five minutes, allowing for quick and sturdy repairs within a short period.
• Haze Resistance
Optically clear epoxy adhesives do not remain visible after they get cured. It implies that they offer a transparent and clear result with no fog, haze, or condensation over the optical component.
• Low Shrinkage
Shrinkage is highly detrimental to optical components. However, optically clear epoxy adhesives remain free from this issue owing to their low shrinkage properties.
• Versatility
Optically clear epoxy adhesives are highly versatile and can get used for fixing a broad range of items and materials. They can include metal, ceramic, wood, tile, and glass. In addition, they can get used for lamination, surface repair, and gap-filling purposes.
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Product Category: Epoxy Encapsulant
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
Product Category: Epoxy Underfill Adhesive
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Product Category: Conductive silver adhesive
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
Product Category: Epoxy Structural Adhesives
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Product Category: UV curing adhesive
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
Product Category: PUR reactive hot melt adhesive
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.