Is Polyurethane Potting Compound For Electronics Better Than Silicone And Acrylic Potting Compound?
When looking for protection for sensitive electronic components, you want a material that will do the job effectively without interfering with how the device functions. Potting is among the methods you can use to apply the selected compounds on sensitive components, thus coating them and keeping them protected from elements that would otherwise harm them.
Different potting compound formulations are available in the market today, and they come with varying potentials for different applications. Polyurethane is among the top materials used in potting electronics. It is a good choice for electronics because it has a thermal range that can easily handle operating temperatures for most industrial products. The material is also cost-effective compared with silicone, making it practical even for small applications needing protection.
A potting material’s suitability depends largely on your application needs and requirements. In some cases, therefore, silicone will be a better choice than polyurethane and vice versa. When you replace silicone with polyurethane potting compound for electronics, you will enjoy advantages such as:
• Lowered costs because the polymer is more economical than silicone. The application process’s costs will also be lowered as a result.
• Lowered permeability for water vapor because polyurethane offers better protections against water migration that leads to corrosion
• Reduced outgassing considering polyurethane compounds utilize varying raw materials.
• Better adhesion as the material offers increased bond strength compared with silicone. You can trust the adhesion polyurethane offers your casings and substrates.
• Improved abrasion and elongation resistance and high strength because of the generally good physical attributes of the polymer
• Wider formulation latitude so you can have the coating as soft as silicone gel or as rigid as that of epoxy but retaining the good points of polyurethane.
• Optimal operating range of temperature making it suitable for most applications
Polyurethane potting compounds
Polyurethane compounds come in various properties, from soft, flexible gels, to stiffer rigid materials with epoxy-like properties. Polyurethane compounds come in handy when looking for a quick solution for your high-production electronics because of their short processing time. Most of the compounds in the market are affordable and formulated to meet performance requirements.
There is also the option of two-component polyurethane adhesives for potting your electronics. This adhesive replicates hardness, including rubber, thermoplastic, glass, and gel. For potting, the two compound polyurethanes are versatile and have variable viscosity, low durometer, excellent electrical insulation, reliable dielectric function, and thermal conductivity, which is impressive.
The potting polyurethane gel is highly adaptable to thermal insulation and bonding performance, but its surface is too soft and can foam. Curing can also be insufficient, and the surface can become brittle when exposed to high temperatures during curing. You may also have issues with surface roughness after curing and weak anti-vibration and anti-aging properties.
As good as polyurethane compounds are compared to silicone in some cases, you need to ensure that you get the right viscosity for your electronic protection requirements. Getting wrong with the material supposed to protect your components will only put you in more trouble with costs. DeepMaterial is among the best manufacturer you can trust to guide you through potting compounds and all things adhesive. If superior quality is what you are looking for, this is the company you should go for.
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.
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DeepMaterial
Best epoxy adhesive glue manufacturer in China, our adhesives are widly used in consumer electronic, home appliance, smart phone, laptop and more industries. our R&D team customizes glue products for customers to help customers reduce costs and improve process quality. Glue products are delivered quickly and ensure their environmental friendliness and performance.
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