Views: 120 Author: Best Electronic Adhesives Glue Manufacturer Publish Time: 2023-01-03 Origin: https://www.deepmaterialcn.com/
How To Find The Best PCB Potting Material For Circuit Boards
Potting has become a popular method of keeping printed circuit boards safe from harmful elements. For electronic manufacturers, it gives them more confidence in the products they release in the market in terms of performance and durability. And for consumers, potted electronics give them joy as they know they can use them in all kinds of environments without risking damages that render them dysfunctional; it is a win-win situation for both.
In potting, the circuit boards are enclosed in a shell and covered with the right resin to keep them safe. The top compounds used in the method are epoxy, polyurethane, and silicone. Their different characteristics help determine which is best for which circuitry requirements, especially regarding hardness, viscosity and curing. Here is a highlight of finding the best PCB potting material.
Know exactly what you need
If you are a fabricator or a manufacturer of electronics with circuit boards, you should start by knowing your exact production requirements. The quantity of the production can help in choosing a quick and easy material to apply, as well as fast in curing. It also helps decide whether you will leave the pot to dry naturally or whether it is necessary to induce heat to hasten the process.
Other things you should look at to determine exactly what type of material you need are the color suitable for the PCBs, the thickness, hardness, or flexibility. If your circuits have sensitive components that are easily damageable, it is best to settle for a light and flexible material like silicone. If a rigid hard layer best suits the board, use epoxy compounds. Knowing exactly what you need is a matter of comparing the top potting compounds against the electronics you need to pot.
Decide on the quantity
The potting compound amount you need for two circuit boards differs from what you would need for a whole electronic production line. When you know the quantity you need, you will easily know whether all you need is a tube of the potting compound or a whole gallon of the same. When dealing with large quantities, it is cheaper to source straight from manufacturers rather than buying at your local hardware store.
Find a reputable supplier
The quality of your potting results depends largely on the quality of the products used. This makes it very important to ensure you get products only from brands with a good reputation with quality. Even when you have to buy directly from a manufacturer, you should ensure you can fully rely on their products. Apart from offering you top-quality products, a good supplier will offer a user guide on how to use the potting compounds and even have services on standby in case you need professional help.
Because some applications require special products, working with a manufacturer who can formulate products especially for you, is a good way of ensuring you get only the best in the end. DeepMaterial has everything you could need for PCB protection. The manufacturer produces top-quality potting compounds, adhesives, and resins to match all application needs.
For more about how to find the best pcb potting material for circuit boards,you can pay a visit to DeepMaterial at https://www.epoxyadhesiveglue.com/tips-to-handle-potting-material-for-pcb-to-get-best-results/ for more info.
Product Category: Epoxy Encapsulant
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
Product Category: Epoxy Underfill Adhesive
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Product Category: Conductive silver adhesive
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
Product Category: Epoxy Structural Adhesives
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Product Category: UV curing adhesive
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
Product Category: PUR reactive hot melt adhesive
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.