Views: 9 Author: Best Electronic Adhesives Glue Manufacturer Publish Time: 2022-12-19 Origin: https://www.deepmaterialcn.com/
Choosing a reliable electronic epoxy encapsulant potting compounds from potting epoxy manufacturers
Manufacturers dealing with LED fabricators or other components must protect the parts. This means finding an ideal potting compound. The compound you pick influences the fabricated parts a lot. Knowing a few things about the compounds is important to make the selection process much easier.
Potting materials usually are in the form of liquid resins that are allowed to flow over the circuit board to offer the needed protection for the components. Some components and devices are potted to offer elements, impact, vibration, heat, and water.
Potting materials options
There are 3 most common potting materials. Each has its drawbacks and benefits.
Urethane and epoxy
These are the most commonly used materials for purposes of potting electronics. They offer protection because they are hard. The electronic parts remain well covered. The temperature tolerance of urethanes stands at 180 degrees. Epoxy stands at 250 degrees, but this depends on the specific products.
Urethanes and epoxies provide good adhesion and are not easy to remove. This is because they are very tough. They can protect intellectual property, making it hard to reverse-engineer some products. Your products remain safe from competitors.
One of the greatest things about this compound is its adhesion and strength. However, this is a weakness as well. Removing them becomes an issue once the potting has been applied. This means repairs can be very hard, and you may have to scrap the parts when repairs are needed.
The other issue is that these compounds are exotherms. Heat is produced as they cure. This heat can be rather high and can end up damaging components.
Silicone
These potting compounds have unique characteristics. There are so many fabricators in the electronic industry that use silicone. It comes with great benefits and is easy to use. Silicone allows repairability. It is very easy to remove silicone from parts. Every part can be removed without destroying the structure.
Silicone has good temperature Resistance as well. Modern components today usually get very hot and create temperatures that are more than what urethane and epoxy can handle. Silicone is one of the compounds that has the widest tolerance.
There are instances where electronic devices, applications, or components may be sunlight exposed. Silicone is a good choice because it offers great resistance and prevents yellowing and cracking, which is common with other materials.
Color temperature is one of the most important characteristics, especially for LED lights. However, the color you get at the end of the day is usually affected by the material used for potting. This color may be distorted or tinted.
The compound is very easy to assemble as well. The potting material flows with a viscosity that is fluid-like.
Getting the highest quality compounds
DeepMaterial is one of the best producers of potting compounds. We have been in the market for a long time and are in a position to offer higher-quality epoxy, urethane, and silicone compounds. Working with us means that you gain access to the highest quality compounds that can be used in different situations. Before making a purchase, you need to understand the need at hand and the characteristics of a compound.
We offer a wide array of products that you can choose from. For more about choosing a reliable electronic epoxy encapsulant potting compounds from potting epoxy manufacturers,you can pay a visit to DeepMaterial at https://www.epoxyadhesiveglue.com/is-potting-epoxy-resin-for-electronics-a-good-choice-from-potting-epoxy-manufacturers/ for more info.
Product Category: Epoxy Encapsulant
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
Product Category: Epoxy Underfill Adhesive
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Product Category: Conductive silver adhesive
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
Product Category: Epoxy Structural Adhesives
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Product Category: UV curing adhesive
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
Product Category: PUR reactive hot melt adhesive
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.