Applications And Benefits Of Epoxy Potting Compound And Encapsulant
Electronic assemblies require protection against thermal dissipation, shock, vibration, corrosion, and moisture, among other elements. You can achieve protection through different methods, including potting. Potting is the process of filling the electronic assemblies with compounds that offer added protection to them permanently. Potted electronics are more durable and reliable in performance which is what every manufacturer and user is looking for.
The potting compounds used feature different materials, curing requirements and speed, and viscosities. The different characteristics are important because all electronic components do not need the same level of protection; what works for one component may not work as well for another. Epoxy, silicone, and urethane are the commonly used potting compounds; they each have advantages and disadvantages.
Epoxy potting compounds
Epoxy resin makes a great material for protecting electronic assemblies because it is resistant to most environmental conditions. Epoxy potting compounds are especially good for high temperatures and moisture environments. Their mechanical strength also makes them ideal for many other applications.
Essentially, what you stand to get from the compounds includes high tensile strength, rigidity, and dielectric properties. They offer the optimal solution to various electrical components, including transformers and switches.
The benefits
Potting tends to offer applications permanent protective solutions, thus increasing their durability and reliability. Epoxy compounds come with benefits like:
• Crack resistance
• Chemical protection
• Corrosion protection
• Improved mechanical strength
• Enhanced environmental protection
• Heat dissipation
• Electrical insulation
• Thermal shock and vibration resistance
The moisture resistance benefit of epoxy compounds in potting makes it an excellent choice for many, especially outdoor applications. The many characteristics of the resin have given it popularity in different sectors, including the automotive, aerospace, and consumer electronic industries.
Applications
As a result of the many impressive characteristics epoxy compounds have, they are largely used in the following:
• IP protection
• Circuit protection for gas and oil sensors
• Printed circuit board protection, especially in commercial transportation
• LED drivers
• Transmitter components in deep-sea cables for telecommunication
Epoxy compounds are categorized in grades, but they all have self-leveling and low-viscosity characteristics. This makes them suitable for application with high production volumes and fragile component production lines. The grades can be formulated to achieve specific application requirements. For instance, the resin can be formulated to produce the thermal conductivity you prefer. You can also get a formulation that is room temperature curable or flame retardant.
The material you choose for potting your electronics will determine the results you get. It is important to ensure that you use only compounds that are best for the protection you are looking for. Using the wrong compounds will not only leave you with compromised protection but could also ruin your components permanently.
DeepMaterial is a manufacturer that can turn all your resin and adhesive dreams into reality. The company has experts who will formulate special compounds to match your applications in the best way and advise you on the best way to go with your potting. Products from the manufacturer are superior quality, so whether you are getting epoxy or silicone for your electronic components, you know you will get the very best.
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.
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DeepMaterial
Best epoxy adhesive glue manufacturer in China, our adhesives are widly used in consumer electronic, home appliance, smart phone, laptop and more industries. our R&D team customizes glue products for customers to help customers reduce costs and improve process quality. Glue products are delivered quickly and ensure their environmental friendliness and performance.
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