The BGA underfill process with underfill epoxy and other optionsBGA stands for ball grid array. These need reliable underfill, and different materials can be used. BGA underfill protects circuit boards so that they don’t get damaged by different environmental threats, such as thermal damage. In indu

How To Use Smt SMD Epoxy Adhesive Red Glue For PCB Underfill ProcessSMT adhesive Red Glue is a type of double-sided sticky tape, also known as an adhesive or Glue. It is available in sheets or strips and sticks components of printed circuit boards together. The article's purpose is to instruct peopl