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SMT underfill

Read more articles about SMT underfill, SMT underfill sealants, adhesive & glue products in China.
2023
DATE
01 - 04
The BGA underfill process with underfill epoxy and other options
The BGA underfill process with underfill epoxy and other optionsBGA stands for ball grid array. These need reliable underfill, and different materials can be used. BGA underfill protects circuit boards so that they don’t get damaged by different environmental threats, such as thermal damage. In indu
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