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SMT Underfill Epoxy

Read more articles about SMT Underfill Epoxy, SMT Underfill Epoxy sealants, adhesive & glue products in China.
2023
DATE
01 - 04
The BGA underfill process with underfill epoxy and other options
The BGA underfill process with underfill epoxy and other optionsBGA stands for ball grid array. These need reliable underfill, and different materials can be used. BGA underfill protects circuit boards so that they don’t get damaged by different environmental threats, such as thermal damage. In indu
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2022
DATE
07 - 14
The Pros And Cons Of One Component Epoxy Resin Adhesive Underfill Compounds For Flip Chip CSP BGA And Micro-BGA Assemblies
The Pros And Cons Of One Component Epoxy Resin Adhesive Underfill Compounds For Flip Chip CSP BGA And Micro-BGA AssembliesWhen selecting the best epoxy filling compounds to fill your project, it can be challenging to determine which one you should pick. Therefore, before you make the decision, you n
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