Product Category: Semiconductor packaging and testing UV viscosity reduction special film
The product uses PO as the surface protection material, mainly used for QFN cutting, SMD microphone substrate cutting, FR4 substrate cutting (LED).
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Product Specification Parameters
Product Model | Product Type | Thickness | Peel Force Before UV | Peel Force After UV |
DM-208A | PO+UV tack reduction | 170μm | 800gf/25mm | 15gf/25mm |
DM-208B | PO+UV tack reduction | 170μm | 1200gf/25mm | 20gf/25mm |
DM-208C | PO+UV tack reduction | 170μm | 1500gf/25mm | 30gf/25mm |
Product Specification Parameters
Product Model | Product Type | Thickness | Peel Force Before UV | Peel Force After UV |
DM-208A | PO+UV tack reduction | 170μm | 800gf/25mm | 15gf/25mm |
DM-208B | PO+UV tack reduction | 170μm | 1200gf/25mm | 20gf/25mm |
DM-208C | PO+UV tack reduction | 170μm | 1500gf/25mm | 30gf/25mm |