| Product number | color | viscosity cP
@ 25℃ | Tg ℃ | ETC PPM/℃ (<Tg) | ETC PPM/℃ (>Tg) | curing conditions | Packaging Specifications | Shelf life | Storage conditions | Applications |
| HS700 | black | 2300~2900 | 65 | 70 | 155 | recommend:20Min@80℃Optional:8Min@150℃ | 30CC/50CC | 1year@-40℃ 6month@-20℃ | -20~-40℃ sealed storage | memory card andCCD/CMOSPackaging; Lithium battery protection board chip packaging |
| HS701 | light yellow | 1500~1800 | 65 | 70 | 155 | recommend:20 Min @ 80 ℃ Optional: 8Min @130℃ 5Min @ 150℃ | 30CC/55CC | 1year@-40℃ 6month@-20℃ 2week@-5℃ | -20~-40℃ sealed storage | memory card andCCD/CMOSPackage; Bluetooth module chip filling |
| HS702 | yellow | 1400~2000 | 65 | 70 | 155 | recommend:5Min @ 145℃ | 30CC/55CC | 1year@-40℃ 6month@-20℃ | -20~-40℃ sealed storage | Chip bottom and surface filling; lithium battery protection board chip packaging |
| HS703 | black | 350~450 | 113 | 55 | 171 | recommend:8 Min @ 130 ℃ | 30CC/55CC | 1year@-40℃ 6month@-20℃ 3sky@ 25℃ | -20~-40℃ sealed storage | used forCSP/BGA, Serviceable, Handheld Lightweight Mobile Communication/entertainment device applications; automotive electronics; chip filling |
| HS704 | black | 500 | 67 | 55 | 185 | recommend:8 Min @ 130 ℃ | 30CC/55CC | 6month@-20℃ 3sky@25℃ | -20~-40℃ sealed storage | used forCSP/BGA, Serviceable, Handheld Lightweight Mobile Communication/Entertainment equipment applications; chip filling for Bluetooth headsets and smart wearables |
| HS706 | White/transparent | 1300-1500 | 65 | 70 | 155 | recommend:20Min @ 80℃ Optional:>8 Min@130℃ 5Min @ 150℃ | 30CC/55CC | 1year@-40℃ 6month@-20℃ | -20~-40℃ sealed storage | memory card andCCD/CMOSPackaging; chip filling for Bluetooth headsets and smart wearables |
| HS707 | light yellow | 1300~1500 | 50~70 | 60 | 200 | 5 ~ 7 Min @ 145 ~ 150 ℃ | 30CC/55CC | 6month@2~10℃ 7sky@25℃ | 2~10℃ sealed storage | used forBGAorCSPbottom padding movePOST;Chip fill |
| HS708 | black | 1500~2500 | 50~70 | 60 | 200 | 5 ~ 7 Min @ 145 ~ 150 ℃ | 30CC/55CC | 6month@2~10℃ 7sky@25℃ | 2~10℃ sealed storage | used forBGAorCSPbottom padding movePOST;Chip fill |
| HS710 | black | 340 | 123 | 56 | 170 | recommend:8Min@150℃ | 30CC/55CC | 1year@-40℃ 6month@-20℃ | -20~-40℃ sealed storage | for chips |
| HS721 | black | 890,000~ 1,490,000 | 152 | 22 | 210 | recommend:30 Min @ 125 ℃ (heating plate) Optional:60 Min @ 165 ℃ (convection oven) | 10CC/30CC | 9month@-40℃ | -40℃ sealed storage | BGAandCIstorage card,Ceramic packages and flex circuit flip chips; wafer level flip chips |
| HS723 | black | 6500 | 75 | 60 | 155 | recommend:10-15Min@150℃ | 30CC/50CC/200CC | 1year@-40℃ 6month@-20℃ | -20~-40℃ sealed storage | memory card andCCD/CMOSpackaging; electronic cigarette |
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