Product number | Exterior | Viscosity mPas @ 25℃ | curing conditions | Packaging Specifications | Storage conditions | Applications |
HS610 | black | 40000±10% | 5~10Min @ 80℃ 15~25Min @ 70℃ 25~35Min @ 60℃ | 30ml/branch | 3month @ 5℃ 6month @ -20℃ | Bonding thermally sensitive components, suitable for memory cards,CCD/CMOSand other products;PCBABonding and reinforcement of various active and passive components in assembly; fingerprint module; encapsulation around the chip |
HS611 | black | 12000~15000 | 20Min @ 80℃ 30Min @ 70℃ 60Min @ 60℃ | 30ml/branch | 6month@ -20℃ 7sky@ 25℃ | Bonding thermally sensitive components, suitable for memory cards,CCD/CMOSand other devices;VCMMotor voice coil assembly |
HS614 | black | 10000-13000 | 5 min @ 80℃ 10min @ 70℃ | 30ml/branch | 6month@-20℃ 7sky@ 25℃ | Bonding of temperature-sensitive materials;CMOSModule bonding |
HS615 | White | 81000±10% | 5~10 min @ 80°C 25~35 min @ 60°C | 30ml/branch | 6month@ -20℃ | Bonding thermally sensitive components, suitable for memory cards,CCD/CMOSand other products;PCBABonding and reinforcement of various active and passive components in assembly;ledBacklight |
Material properties before curing | |
chemical type | Modified epoxy resin |
Exterior | black viscous liquid |
Specific gravity (25℃, g/cm 3 ) | 1.4 |
Viscosity (5rpm 25℃) | 40,000±10% |
Cure loss @80@, TGA, W1%) | <0.5 |
Pot life@25℃ | 7 days |
Copper mirror corrosion | No corrosion |
Curing principle | heat curing |
Material properties after curing | |
Thermal expansion coefficient UM/M/℃ | <TG 24 |
ASTM E831 86 | >TG 185 |
glass transition temperature | 50 |
Water absorption (24hrs in water@25℃),% | 0.13 |
Soak in indoor distilled water for 24 hours | Tensile Strength, ADTM D638, MPA 12.5 |
Tensile Strength, ADTM D638, MPA 47.3 | |
Dielectric constant
Dielectric loss IEC 60250 | 1 KHZ 5.45 0.038 |
1MZ 4.41 0.056 | |
Volume resistivity, IEC60093.Ω.CM | 9.1*10 13 |
Surface resistivity, C60093.Ω | 2.0*10 15 |