What You Need To Know About Potting And Encapsulating Compound
Potting and encapsulation are ways of protecting electronic components. Through the processes, electronics become resistant to harsh chemical and physical shock, moisture, and thermal changes. These situations compromise the durability and functionality of electronic devices without protection. More electronic manufacturers and fabricators are now embracing the coating of the most essential parts of their devices, so functionality in all kinds of situations is guaranteed.
The compounds used for potting and encapsulating also offer electrical insulation and protection from physical tampering giving product manufacturers more confidence in what they avail to the market. With the right potting compound, long-lasting and reliable performance is achieved.
In potting, the component shell is filled with a suitable resin that attaches it to be part of the whole part. In encapsulation, the resin is allowed to harden and then separated from the component, then used as part of an assembly. But generally, the two terms refer to the protection of components through resin coating. The application usually determines which method is used to offer the needed protection.
Uses
Potting and encapsulation compounds are used in applications where components require protection. The methods are used in
• Energy systems, transformers, turbines, generators.
• Printed circuit boards like those on computers, speakers, computers, and many other appliances
• Avionic equipment facing high thermal and physical changes
The compounds
Potting and encapsulation use different types of compounds for the desired results to be achieved. The type of protection needed for the electronic usually commands what compound is most suited. The major potting compounds are;
Silicone resins operate over a huge range of temperatures compared with the rest. Silicone has impressive physical flexibility and is resistant to harsh chemicals, water, and UV light. Silicone compounds are best for electronics that take physical punishment because they move with the components offering all-around protection. It is, however, not a very good option for electronics requiring high thermal cycling and strong rigidity.
Epoxy resins are the other potting compounds you will find, and they offer excellent temperature and chemical resistance. If you work with high-voltage applications, epoxy potting compounds are your ideal solution because of their dielectric strength. Epoxy can, however, be brittle, especially in low temperatures causing issues with temperature changes during curing.
Polyurethane resins are also popular among users because they are flexible to epoxies. The compounds are great for applications in low-temperature environments and thermal cycling but less suitable where high resistance to chemicals and high temperatures is needed. Apart from the three major compounds, other potting compounds are also available.
They include:
Heat-conductive compounds are suitable for heat-producing components. The compounds are formulated to allow thermal dissipation and prevent too much component insulation that can be harmful in the conditions.
UV curing compounds that cure in just a few seconds thus offering quick solutions for a given application. These compounds are the fastest in curing, but they are not suitable where thick potting and encapsulation are needed because they may not fully cure.
Hot melts also protect components by creating watertight seals rapidly.
When looking for the best potting and encapsulating compound, know exactly what your application needs and choose accordingly; not every compound will work well for your components. Deep Material is the solution to all your adhesive and potting needs.
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.
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DeepMaterial
Best epoxy adhesive glue manufacturer in China, our adhesives are widly used in consumer electronic, home appliance, smart phone, laptop and more industries. our R&D team customizes glue products for customers to help customers reduce costs and improve process quality. Glue products are delivered quickly and ensure their environmental friendliness and performance.
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