Views: 14 Author: Best Electronic Adhesives Glue Manufacturer Publish Time: 2022-12-13 Origin: https://www.deepmaterialcn.com/
Things to note about epoxy potting material for electronic assembly
For electronic assemblies, there is a need for protection against different factors such as thermal dissipation shock, vibration, corrosive agents, and moisture. This kind of protection can only be achieved through potting. This process involves filling different electronic assemblies using compounds that give permanent and added protection to any assembly.
There are different potting compounds that you can choose from. They are all unique in their way. They come with different viscosities and are cured in their unique way. There are many characteristics that can be used to distinguish one from the next. The most popularly used are epoxy, urethane, and silicone. Here, we will take a look at epoxy.
What's an epoxy potting compound?
One of the greatest benefits of potting is that they provide comprehensive and reliable protection against different environmental conditions. These potting compounds can handle high temperatures and offer the best moisture resistance. They also offer a very high degree of mechanical strength.
With epoxy, you get a very high rigidity level, tensile strength, and modulus. They have amazing dielectric properties, making them one of the best options for potting all sorts of electrical components like transformers and switches.
Application and benefits of epoxy potting
When used in electronics, you get permanent protection. This is a solution that will stay intact throughout electronic life. Epoxy plays a major role in assemblies' long-term protection, providing a wide range of benefits in the process. This includes abrasion protection and better thermal management. There are many other benefits associated with potting compounds. They include:
• Heat dissipation
• Environmental protection
• Enhanced mechanical strength
• Electrical insulation
• Crack resistance
• Corrosion protection
• Chemical protection
• Thermal shock and vibration resistance
One of the main advantages associated with these potting compounds is the fact that they have an amazing resistance to moisture. This makes them such a good choice for applications that are outdoors. They come with the best adhesion, chemical, and high-temperature resistance. These characteristics make them widely used in consumer electronics, automotive, and aerospace industries.
The most common applications where epoxy can be used include:
• IP protection
• Gas sensors protection
• Protecting PCBs
• LED drivers ruggedization
• Transmitter protection in telecommunication cables
Many characteristics make epoxy such a good choice for different applications. It is the best way of protecting those fragile components. What you note is that there are different epoxy compound grades that you can choose to work with. To find the best, you ought to know what you need exactly. This is because each option is created in a way that meets very specific application requirements.
There is also the possibility of improving the compounds to be better and custom-made, especially for specific applications.
DeepMaterial
DeepMaterial is pcb potting material manufacturers and potting compound suppliers in china,manufacturing potting epoxy for electronic,silicone potting compound for electronics,polyurethane potting compound for electronics,potting and encapsulating compound,epoxy potting compound,clear silicone potting compound,underwater electrical potting compound,adhesives for potting electronics,potting electronics with hot glue and so on.
At deepmaterial, you can access the best epoxy potting compounds. Choosing to work with a well-established company means you get your hands on the latest technology and are in a position to make some high-quality products and get superior results in your applications.
By finding a durable and reliable potting compound, you should be able to achieve a lot. We can custom-make compounds depending on your requirements and guide you in the selection process. One thing to note is that epoxy gives a rather solid and permanent result. Having an evaluation of your process can help us determine whether epoxy compounds are indeed the best choice or not.
For more about things to note about epoxy potting material for electronic assembly,you can pay a visit to DeepMaterial at https://www.epoxyadhesiveglue.com/category/pcb-potting-material/ for more info.
Product Category: Epoxy Encapsulant
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
Product Category: Epoxy Underfill Adhesive
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Product Category: Conductive silver adhesive
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
Product Category: Epoxy Structural Adhesives
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Product Category: UV curing adhesive
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
Product Category: PUR reactive hot melt adhesive
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.