Views: 48 Author: Best Electronic Adhesives Glue Manufacturer Publish Time: 2022-12-29 Origin: https://www.deepmaterialcn.com/
Potting Electronics With Silicone – How It Helps Protect The Electronics
Electronics have taken over human life so much that we need them to run almost every area of our lives. Even learning that was once a physical interaction in a school setup can now be handled virtually using mobile phones and computers. The different technologies used for different areas rely on electrical components like processing units, sensors, printed circuit boards, and actuators. These components can be harmed by environmental conditions, including moisture and heat, and therefore need protection.
Potting and encapsulating are some of the methods used in keeping sensitive components safe, and different compounds are used to achieve the desired results. Potting involves putting an electronic component or assembly in a case and then filling it with a resin that forms a protective layer around it after curing. Epoxy is one of the materials used in potting electronics and a favorite for many. The material offers good defense against damaging outside aggression which is what everyone is looking for.
Silicone is available in a wide range of gels and rubbers, most of which are recommended for electronic appliances. The products ensure environmental and mechanical protection through properties like:
• Excellent dielectric strength
• Moisture resistance
• Low modulus, which is good for reducing internal stress
• Damping properties
• Excellent adhesion where needed
• Environmental resistance
• Flame resistance
• Thermal resistance
Clear silicone also has the advantage of leaving components visible for light to penetrate as needed for led lights, sensors, and component inspection purposes. The stability of this potting material has made it popular in applications requiring electrical insulation, fire and temperature resistance, and good adhesion. It is durable and reliable and will make electronics last long, serving and performing as expected. With longer-lasting electronics, landfill waste is greatly reduced.
Potting electronics with silicone offers unmatched flexibility. This material easily conforms to the electrical components without interfering with how they operate. If the pot needs repair or rework, the material can be removed just as easily using the right solvents. This, unfortunately, means that the compound does not do very well when exposed to harsh chemicals and solvents. The other downside of using silicone to pot electronics is the cost. Even in small quantities, the material is costlier than other potting compounds; you will find it very impractical with small projects.
Because silicone comes in a wide range of gels and rubbers, you must ensure that you are getting your products from reputable sources. You also must ensure that you get the right product for your electronics' potting needs. One of the best places to get high-quality silicones for your potting projects is DeepMaterial Company.
This manufacturing company offers nothing but top potting products made with high-quality materials. If your application requires special formulations, Deep Material will use its expertise and knowledge to formulate a special product just for you. The products you can get include potting compounds, resins, and adhesives. Whether you are looking for UV or heat curing products, bonding, or protective films, Deep Material has the solution for you.
For more about potting electronics with silicone – how it helps protect the electronics,you can pay a visit to DeepMaterial at https://www.epoxyadhesiveglue.com/category/pcb-potting-material/ for more info.
Product Category: Epoxy Encapsulant
The product has excellent weather resistance and has good adaptability to natural environment. Excellent electrical insulation performance, can avoid the reaction between components and lines, special water repellent, can prevent components from being affected by moisture and humidity, good heat dissipation ability, can reduce the temperature of electronic components working, and prolong the service life.
Product Category: Epoxy Underfill Adhesive
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Product Category: Conductive silver adhesive
Conductive silver glue products cured with high conductivity, thermal conductivity, high temperature resistance and other high reliability performance. The product is suitable for high-speed dispensing, dispensing good conformability, glue point does not deform, not collapse, not spread; cured material moisture, heat, high and low temperature resistance. 80 ℃ low temperature fast curing, good electrical conductivity and thermal conductivity.
Product Category: Low temperature curing epoxy adhesive
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
Product Category: Epoxy Structural Adhesives
The product cures at room temperature to a transparent, low shrinkage adhesive layer with excellent impact resistance. When fully cured, the epoxy resin is resistant to most chemicals and solvents and has good dimensional stability over a wide temperature range.
Product Category: UV curing adhesive
Acrylic glue non-flowing, UV wet dual-cure encapsulation suitable for local circuit board protection. This product is fluorescent under UV(Black). Mainly used for local protection of WLCSP and BGA on circuit boards. Organic silicone is used to protect printed circuit boards and other sensitive electronic components. It is designed to provide environmental protection. The product is typically used from -53°C to 204°C.
Product Category: PUR reactive hot melt adhesive
The product is a one-component damp-cured reactive polyurethane hot-melt adhesive. Used after heating for a few minutes until molten, with good initial bond strength after cooling for a few minutes at room temperature. And moderate open time, and excellent elongation, fast assembly, and other advantages. Product moisture chemical reaction curing after 24 hours is 100% content solid, and irreversible.