| Product number | color | curing conditions | Storage conditions | Packaging Specifications | Sizing process | Applications |
| HS8010 | Red | 60~90S @ 150℃ | 6month@ 2~8℃ 1month@ 25℃ | 30mlSyringe;300ml | high speedSMTMounter Dispensing and stencil printing | for printed circuit boardsSMDComponent bonding |
| HS8020 | Red | 60~90S @ 150℃ | 6month@ 2~8℃ 1month@ 25℃ | 30mlSyringe;300ml | high speedSMTMounter Dispensing and stencil printing | printed circuit boardSMD Component bonding |
| HS8030 | Red | 60~90S @ 150℃ | 6month@ 2~8℃ 1month@ 25℃ | 30mlSyringe;300ml | high speedSMTMounter Dispensing and stencil printing | printed circuit boardSMD Component bonding |
| HS8600 | Red | 60~90S @ 150℃ | 6month@ 2~8℃ 1month@ 25℃ | 200g;360g;1KG | Manual stencil printing | printed circuit boardSMDComponent bonding |
| HS8610 | Red | 60~90S @ 150℃ | 6month@ 2~8℃ 1month@ 25℃ | 200g;360g;1KG | Manual stencil printing | printed circuit boardSMDComponent bonding |
| HS8620 | Red | 60~90S @ 150℃ | 6month@ 2~8℃ 1month@ 25℃ | 200g;360g;1KG | Manual stencil printing | printed circuit boardSMDComponent bonding |
| HS8630 | Red | 120~150S @ 120℃ | 6month@ 2~8℃ 1month@ 25℃ | 200g;360g;1KG | Manual stencil printing | printed circuit boardSMDComponent bonding |
| HS8650 | Red | 60~90S @ 150℃ | 6month@ 2~8℃ 1month@ 25℃ | 200g;360g;1KG | Manual stencil printing and block printing | printed circuit boardSMDComponent bonding |
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